Samsung DDR6-12800 Memory Currently In Development, GDDR6+ To Offer Up To 24 Gbps & GDDR7 Up To 32 Gbps For Next-Gen GPUs

During its annual tech day, Samsung revealed new information regarding next-gen retention technologies such equally DDR6, GDDR6+, GDDR7 & HBM3.

Samsung Beings Development of DDR6 & GDDR6+ Retention Technologies, Besides Talks GDDR7 & HBM3 Standards For Next-Gen GPUs

Computerbase managed to go hold of the data from Samsung who discussed the adjacent-gen memory standards. The most recent leap in the retentiveness blueprint came with the launch of DDR5. The standard is now up and operational on Intel's 12th Gen Alder Lake platform & while at that place are some major issues with supply, memory makers aren't stopping in refining DDR5. Samsung has outlined native JEDEC speeds of DDR5-6400 Mbps & overclocked module speeds of DDR5-8500 Mbps in the near time to come. Currently, retention makers take teased upwardly to 7000 Mbps transfer speeds with initially produced DDR5 DIMMs but that will get better with fourth dimension.

DDR6 Memory Standard In-Development - Upwards To 17,000 Mbps Transfer Speeds

Enter DDR6, the next-generation memory standard is said to exist already in development and will replace DDR5 in the time to come. Since DDR5 only merely launched, nosotros shouldn't look DDR6 till at least 2025-2026+. The DDR4 retentiveness standard stayed with usa for at least six years so we should expect the same timeframe for DDR6's launch.

Every bit for specifications, DDR5 retentiveness is said to double the transfer rate over DDR6 and quadruple over DDR4. The JEDEC speeds are suggested effectually 12,800 Mbps and overclocked DIMMs volition be hitting 17,000 Mbps. Though we should remember that these aren't the maximum potential that Samsung is highlighting for DIMMs.

DDR Memory data rates. (Image Credits: Computerbase)

Nosotros know that some manufacturers take already teased up to 12000 Mbps transfer speeds for future DDR5 DIMMs so nosotros tin can expect DDR6 to easily breach the 20K Mbps barrier in its most refined state. Compared to DDR5 memory, DDR6 volition feature four 16-scrap memory channels for a total of 64 retentiveness banks.

GDDR6+ With 24 Gbps & GDDR7 With 32 Gbps For Next-Gen GPUs

Samsung also revealed its plans to offer a faster GDDR6+ standard which will supplant the existing GDDR6 chips. Currently, Micron is the simply one that has designs for 21 Gbps+ graphics retentiveness ready with its GDDR6X standard. GDDR6+ is more of a refinement of GDDR6 than but upping the bandwidth. It is said to stone speeds of up to 24 Gbps and will be part of the next generation of GPUs. This will allow GPUs with 320/352/384 bit bus layouts to reach over 1 TB/south bandwidth while 256-bit GPUs will exist able to reach up to 768 GB/s bandwidth.

There's also GDDR7 which is currently on the graphics DRAM roadmap and is expected to offering up to 32 Gbps transfer speeds along with a real-time error protection technology. A GDDR7 memory sub-arrangement across a 256-chip broad bus interface at 32 Gbps transfer speeds volition offer 1 TB/s of full bandwidth. That's 1.five TB/s with a 384-scrap charabanc interface and up to 2 TB/south on a 512-flake arrangement. This is just insane amounts of bandwidth for a GDDR standard.

GDDR Memory Specifications:

Feature	GDDR5	GDDR5X	GDDR6	GDDR6X	GDDR6+	GDDR7
Density	From 512Mb to 8Gb	8Gb	8Gb, 16Gb	8Gb, 16Gb	8Gb, 16Gb	8Gb, 16Gb, 32Gb?
VDD and VDDQ	Either 1.5V or 1.35V	1.35V	Either 1.35V or 1.25V	Either ane.35V or 1.25V	TBD	TBD
VPP	N/A	1.8V	1.8V	i.8V	1.8V	TBD
Data rates	Up to 8 Gb/s	Up to 12Gb/s	Up to 16 Gb/southward	19 Gb/due south, 21 Gb/s, >21 Gb/southward	24 Gb/s	32 Gb/s
Package	BGA-170 14mm 10 12mm 0.8mm ball pitch	BGA-190 14mm ten 12mm 0.65mm ball pitch	BGA-180 14mm x 12mm 0.75mm brawl pitch	BGA-180 14mm x 12mm 0.75mm ball pitch	BGA-180 14mm 10 12mm 0.75mm ball pitch?	TBD
I/O width	x32/x16	x32/x16	2 ch x16/x8	ii ch x16/x8	2 ch x16/x8	TBD

HBM3 Memory Product Commences In Q2 2022

Lastly, we have confirmation that Samsung plans to commence the mass production of its HBM3 retention in Q2 2022. The next-gen memory standard will exist powering future HPC and information center GPUs/CPUs. SK Hynix already showcased its own HBM3 memory modules recently and how they offer insane speeds and capacities. More on that here.

HBM Memory Specifications Comparison

DRAM	HBM1	HBM2	HBM2e	HBM3
I/O (Bus Interface)	1024	1024	1024	1024
Prefetch (I/O)	2	2	2	two
Maximum Bandwidth	128 GB/southward	256 GB/s	460.8 GB/due south	819.2 GB/s
DRAM ICs Per Stack	4	8	8	12
Maximum Capacity	4 GB	8 GB	16 GB	24 GB
tRC	48ns	45ns	45ns	TBA
tCCD	2ns (=1tCK)	2ns (=1tCK)	2ns (=1tCK)	TBA
VPP	External VPP	External VPP	External VPP	External VPP
VDD	1.2V	1.2V	1.2V	TBA
Command Input	Dual Control	Dual Command	Dual Command	Dual Control